jetson-nano-baseboard/assets/stackup.csv

1	Name	Type	Material	Thickness[mm]	Constant
2	F.Mask	Top Solder Mask		0.01
3	F.Cu	copper		0.035
4	dielectric 1	core	FR4	0.185714	4.5
5	In1.Cu	copper		0.035
6	dielectric 2	prepreg	FR4	0.185714	4.5
7	In2.Cu	copper		0.035
8	dielectric 3	core	FR4	0.185714	4.5
9	In3.Cu	copper		0.035
10	dielectric 4	prepreg	FR4	0.185714	4.5
11	In4.Cu	copper		0.035
12	dielectric 5	core	FR4	0.185714	4.5
13	In5.Cu	copper		0.035
14	dielectric 6	prepreg	FR4	0.185714	4.5
15	In6.Cu	copper		0.035
16	dielectric 7	core	FR4	0.185714	4.5
17	B.Cu	copper		0.035
18	B.Mask	Bottom Solder Mask		0.01